Dettagli del prodotto
Luogo di origine: Cina
Marca: ZMSH
Certificazione: rohs
Numero di modello: Macchina per il sistema di separazione laser
Termini di pagamento e spedizione
Quantità di ordine minimo: 5
Prezzo: by case
Tempi di consegna: 3-6 mesi
Termini di pagamento: T/T
Capacità di alimentazione: 1000 pezzi al mese
Tipo laser: |
Excimer (193nm/248nm), Femtosecondo (343nm/1030nm) |
Area di lavorazione: |
Max 150 mm × 150 mm |
Velocità di trattamento: |
50 ∼ 300 mm/s |
Spessore di sollevamento: |
10nm–20μm |
Integrazione di sistemi: |
Unità di pulizia EFU, sistema di trattamento dei gas di scarico |
Applicazione: |
Produzione di semiconduttori, elettronica flessibile |
Tipo laser: |
Excimer (193nm/248nm), Femtosecondo (343nm/1030nm) |
Area di lavorazione: |
Max 150 mm × 150 mm |
Velocità di trattamento: |
50 ∼ 300 mm/s |
Spessore di sollevamento: |
10nm–20μm |
Integrazione di sistemi: |
Unità di pulizia EFU, sistema di trattamento dei gas di scarico |
Applicazione: |
Produzione di semiconduttori, elettronica flessibile |
6-12 Inch 1064nm SiC Substrate Laser Separation System Machine Wafers Customized
The Laser Lift-Off (LLO) System is an advanced precision processing technology that utilizes high-energy pulsed lasers to achieve selective material separation at interfaces. This technology is widely applied in semiconductor manufacturing, flexible electronics, optoelectronic devices, and energy sectors. Its core advantages include non-contact processing, high-resolution control, and multi-material compatibility, making it indispensable for applications such as MicroLED mass transfer, flexible display fabrication, and semiconductor wafer-level packaging.
Company Service Highlights:
Customized Solutions: Tailored laser wavelength (193nm–1064nm), power (1W–100W), and automation integration to support R&D and mass production.
Process Development: Laser parameter optimization, beam shaping design, and validation services (e.g., UV laser LLO for sapphire substrates).
Smart Maintenance: Integrated remote monitoring and fault diagnosis, ensuring 24/7 operational support with <2-hour response time.
Parameter | Typical Values | Notes |
Laser Type | Excimer (193nm/248nm), Femtosecond (343nm/1030nm) | Pulse width 5–20ns, peak power >10kW |
Processing Area | Max 150mm × 150mm | Multi-station parallel processing |
Processing Speed | 50–300mm/s | Adjustable per material and laser power |
Lift-Off Thickness | 10nm–20μm | Layer-by-layer delamination capability |
System Integration | EFU clean unit, exhaust gas treatment system | ISO 14644 cleanliness compliance |
LLO operates through selective ablation at material interfaces:
Laser Irradiation: High-energy pulses (e.g., excimer or femtosecond lasers) focus on the target interface (e.g., sapphire-GaN), inducing photothermal/photochemical reactions.
Interface Decomposition: Laser energy triggers gasification (e.g., GaN → Ga + N₂), generating plasma and thermal stress for controlled delamination.
Material Collection: Delaminated microstructures are captured via vacuum suction or fluid dynamics, ensuring contamination-free transfer.
Key Technologies:
Feature | Technical Specifications | Applications |
Non-contact Processing | Laser energy transmitted via optics, avoiding mechanical stress on fragile materials | Flexible OLED, MEMS |
High Precision | Positioning accuracy ±0.02mm, energy density control ±1% | MicroLED transfer, sub-μm patterning |
Multi-material Compatibility | Supports UV (CO₂), visible (green), and IR lasers; compatible with metals, ceramics, polymers | Semiconductors, medical devices, renewables |
Intelligent Control | Integrated machine vision, AI-driven parameter optimization, automated loading/unloading | 30%+ production efficiency improvement |
1. Semiconductor Manufacturing
2. Flexible Electronics
3. Medical Devices
4. Renewables
1. Q: What is a laser lift-off system?
A: A laser lift-off system is a precision processing tool that uses high-energy pulsed lasers to selectively separate materials at interfaces, enabling applications like MicroLED mass transfer and flexible electronics manufacturing .
2. Q: What industries use LLO systems?
A: LLO systems are critical in semiconductor manufacturing (wafer-level packaging), flexible electronics (foldable displays), medical devices (sensor fabrication), and renewables (solar cells), offering non-contact, high-resolution processing .
Tags: #6-12 Inch, #1064nm, # SiC Substrate Laser Separation System Machine, #Wafers Customized