High-Precision Double-Sided Grinding/Polishing Equipment for Sapphire/Glass/Quartz
High-precision double-sided grinding/polishing equipment is a specialized precision machining device designed for hard-brittle materials such as semiconductor wafers, sapphire substrates, optical glass, quartz crystals, ceramics, and metals. By employing dual grinding plates rotating in opposite directions and a planetary motion mechanism, the equipment achieves simultaneous double-sided grinding and polishing, ensuring high planarity (TTV ≤ 0.6 μm), low roughness (Ra ≤ 0.4 nm), and high parallelism (≤ 2 μm). It is widely applied in semiconductor manufacturing, optoelectronics, precision machinery, and aerospace industries, addressing applications like silicon wafer thinning, optical component mirror finishing, and ceramic sealing ring precision grinding, thereby significantly enhancing processing efficiency and yield.
High-Precision Double-Sided Grinding/Polishing Equipment Data
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Categories
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Item
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Lapping machine
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Single disk size(mm)
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φ1112×φ380×50
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φ1230×φ426×50
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φ1350×φ445×50
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Max Outline(mm)
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φ340
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φ390
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φ420
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Positioning machine
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Crystal polishing size(mm)
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φ1149×φ343×50
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φ1253×φ403×50
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φ1380×φ415×50
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Max Outline(mm)
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φ340
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φ390mm
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φ420
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Carrier parameter
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Quantity
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5
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5
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5
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Number of teeth (metric system)
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200
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/
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Module (metric system)
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DP12
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/
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modulo (metric system)
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Driving mode
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1 motor
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/
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/
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2 motors
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Φ12.5kw
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3 motors
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Φ14.7kw
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Φ24.7kw
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Φ25.45kw
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4 motors
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Φ22.7kw
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Φ28.8kw
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Φ35.7kw
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Ability
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75mm
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85
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55
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60
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100mm
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40
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20
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45
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125mm
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25
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25
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30
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150mm
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20
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5
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15
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Power voltage
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3x10+2x6(mm²)
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3x10+2x6(mm²)
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3x10+2x6(mm²)
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Compressed air supply
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0.5-0.6MPa
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0.5-0.6MPa
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0.5-0.6MPa
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Size
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2655x1680x2900(mm)
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2700x1950x2780(mm)
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2950x1890x2970(mm)
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Weight
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Approximately 5.5T
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Approximately 8T
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Approximately 8T
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High-Precision Double-Sided Grinding/Polishing Equipment Working Principle
The equipment operates through a planetary motion mechanism:
- Dual-Plate Opposite Rotation: The upper and lower grinding plates rotate in opposite directions to apply uniform grinding forces.
- Planetary Motion Trajectory: Workpieces undergo combined orbital and rotational movements via a planetary wheel system (inner gear ring meshing with sun gears), ensuring synchronous contact with both plates.
- Closed-Loop Pressure Control: Precision pressure regulators and proportional valves dynamically adjust grinding pressure (0–1,000 kg adjustable) to prevent fracture of thin or brittle materials.
- Cooling and Lubrication: Water/oil cooling systems maintain a constant temperature (10–25°C), while grinding slurries (containing diamond microparticles or silicon carbide) are circulated for enhanced precision.
High-Precision Double-Sided Grinding/Polishing Equipment Key Features
1. High-Rigidity Frame Structure
- Cast-forged integrated frame with precision gantry design, achieving 40% improved anti-deformation capability and stability during high-speed operation.
- Automatic lubrication system extends gear and bearing lifespan to over 10,000 hours.
2. Internationally Certified Components
- Core components (e.g., gearboxes, bearings) utilize brands like SEW (Germany), THK (Japan), SKF (Switzerland), ensuring transmission accuracy < 0.005 mm.
- Electrical systems integrate Siemens PLC + Schneider inverters, supporting 0–180 rpm variable speed regulation for diverse material requirements.
3. Intelligent Operation and Process Adaptability
- 7-inch touchscreen HMI enables preset grinding recipes (e.g., rough grinding, fine polishing, and conditioning mode switching), reducing parameter setup time by 60%.
- Built-in PID closed-loop control monitors pressure, speed, and temperature in real time, reducing fragmentation rate to < 0.1%.
4. Flexible Configuration
- Grinding plate diameters range from φ300 mm to φ1,510 mm, accommodating workpiece sizes of 3–300 mm.
- Power configurations vary from single-motor (5.5 kW) to seven-motor (39 kW total) setups, supporting customized pressure-speed combinations.
High-Precision Double-Sided Grinding/Polishing Equipment Applications
1. Semiconductor Industry
- Silicon Wafer/SiC Wafer Thinning: Thickness tolerance ±0.5 μm for 8-inch wafer back-grinding.
- Gallium Arsenide/Sapphire Polishing: Surface roughness Ra < 0.4 nm for LEDs and laser devices.
2. Optics and Precision Components
- Optical Glass/Quartz Lens Finishing: Mirror-like finish (λ/20 for λ = 632.8 nm) for camera lenses and microscope objectives.
- Ceramic Seal Ring Grinding: Planarity < 0.035 mm for high-pressure hydraulic pumps and nuclear valves.
3. Electronics and New Energy
- Ceramic Substrates/IGBT Modules: Thickness consistency < 3 μm to improve thermal dissipation.
- Lithium Battery Electrode Polishing: Roughness Ra < 10 nm to reduce internal resistance.
4. Aerospace and Defense
- Tungsten Steel Bearings/Titanium Seals: Parallelism < 2 μm for extreme temperature/pressure environments.
- Infrared Window Polishing: Low-scattering properties for telescopes and missile guidance systems.
High-Precision Double-Sided Grinding/Polishing Equipment FAQ
1. Q: What materials are suitable for high-precision double-sided grinding/polishing machines?
A: Specifically designed for hard and brittle materials such as sapphire, optical glass, quartz crystals, ceramics, semiconductor silicon wafers, and metals, supporting simultaneous double-sided ultra-precision processing.
2. Q: What precision levels can double-sided grinding machines achieve?
A: Flatness ≤2 μm, surface roughness Ra <0.4 nm, thickness tolerance ±0.5 μm, meeting high-end requirements for semiconductor wafers and optical components.
Tag: #High-Precision Double-Sided Grinding/Polishing Equipment, #Customized, #Sapphire/Glass/Quartz
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