Sapphire Wafer Precision Cutting Diameter 60mm Thickness 3mm Optical Infrared Window
Sapphire wafer is a precision optical component fabricated from high-purity aluminum oxide (Al₂O₃) single-crystal material, with specifications of 60mm in diameter and 3mm in thickness. It achieves high-precision dimensional control through directional cutting techniques (e.g., laser cutting or diamond wire sawing), with surface roughness controlled to <0.5μm. The crystal orientation options include C-plane (<0001>), A-plane (0001), and M-plane (10-10), catering to diverse application requirements. Inheriting the inherent advantages of sapphire, sapphire wafer ardness (Mohs hardness of 9), high-temperature resistance (melting point of 2045°C), low thermal expansion coefficient (5.3×10⁻⁷/°C), and broad-spectrum transparency (0.15–5.5μm), making it a core material for advanced optoelectronics, semiconductors, and precision instrumentation.
Sapphire Wafer Technical Parameter
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Parameter
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This Product (60mm×3mm)
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Thermal Conductivity
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42 W/m·K
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Bending Strength
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350 MPa
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Transmittance (400nm)
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>85%
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Temperature Range
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-200–1600°C
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Cost per Piece (CNY)
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800–1200
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(Data based on C-plane cutting and double-sided polishing. Customizable parameters available.)
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Sapphire Wafer Key Features & Advantages
1. Extreme Environmental Adaptability
- Sapphire wafer maintains stability under high temperatures (>300°C), strong acids/alkalis, and high-vacuum environments. Suitable for aerospace sensors, laser windows, and other harsh scenarios. Exhibits outstanding thermal shock resistance (withstand temperature differentials >1000°C) without cracking.
2. Superior Optical Performance
- High Transmittance: Sapphire wafer with >85% in visible light (400–700nm) and >70% in ultraviolet (200–400nm), outperforming standard glass and quartz.
- Low Absorption: Sapphire wafer with <0.1% absorption in near-infrared (1–5μm), ideal for infrared imaging and quantum communication systems.
3. Mechanical & Chemical Stability
- Scratch Resistance: Mohs hardness of 9, 10× more wear-resistant than quartz, ensuring long-term surface integrity.
- Corrosion Resistance: Withstands all acids/alkalis except hydrofluoric acid, suitable for marine equipment and chemical detection instruments.
4. Precision Fabrication
- Achieves ±0.02mm thickness tolerance and ±0.05mm diameter tolerance, ensuring batch consistency. Offers double-sided polishing (Ra <0.1nm) or single-sided polishing for tailored optical designs.
Sapphire Wafer Application Fields
1. Optoelectronic Devices
- LED Substrates: Sapphire wafer serves as gallium nitride (GaN) epitaxial growth substrates, enhancing LED efficiency (>120 lm/W) and lifespan (>100,000 hours) for high-end lighting and displays.
- Laser Windows: Sapphire wafer used in high-power lasers (e.g., fiber lasers) as input/output mirrors, tolerating >10 MW/cm² intensity with minimized thermal distortion.
2. Semiconductors & Microelectronics
- Wafer Dicing: Sapphire wafer acts as cutting blade substrates for semiconductor wafer slicing, reducing edge chipping (<5%) and improving yield.
- Infrared Sensors: Fabricates 8–12μm infrared detector windows, Sapphire wafer for security surveillance and industrial temperature measurement.
3. Precision Optical Systems
- Camera Lenses: Protects smartphone/camera lenses, tripling impact resistance and reducing weight by 40% at 3mm thickness.
- UV Optical Components: Sapphire wafer enables deep-UV lithography optics (248nm wavelength) for advanced semiconductor manufacturing.
4. Defense & Aerospace
- Missile Nose Cones: Sapphire wafer withstands >800°C temperatures and impacts, safeguarding guidance system optics in extreme conditions.
- Satellite Thermal Control: Sapphire wafer functions as radiation heat sink substrates, regulating spacecraft temperature with ±1°C precision.
5. Emerging Technologies
- Flexible Electronics: Ultra-thin sapphire (3mm) enables foldable smartphone displays with >100,000 bending cycles.
- Quantum Computing: Sapphire wafer acts as photonic chip packaging substrates, reducing signal loss (<0.5 dB/cm).
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Sapphire Wafer FAQ
1. Q: What are the key advantages of sapphire wafer cutting discs (60mm×3mm)?
A: High-temperature resistance (>1600°C), scratch-proof (Mohs 9 hardness), and broad-spectrum transparency (0.15–5.5μm).
2. Q: What’s your MOQ and lead time for customized orders?
A: MOQ starts at 25pcs, standard lead time 2–4 weeks for bulk production.
Tags: #Sapphire Wafer, #Precision Cutting, #Diameter 60mm, #Thickness 3mm, #Optical Infrared Window
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