BOROFLOAT 33 BF33 Borosilicate Glass Wafer for Semiconductor MEMS and Optical Applications

BF33 (BOROFLOAT 33) is a high-performance borosilicate glass wafer manufactured using advanced microfloat technology. It is widely used in semiconductor, MEMS, optical, and microfluidic applications due to its excellent thermal stability, high optical transmission, and strong chemical resistance.

With a thermal expansion coefficient of approximately 3.3 × 10⁻⁶ /K, BF33 closely matches silicon, making it an ideal substrate for wafer bonding, microfabrication, and precision optical systems.

It offers excellent flatness, ultra-low surface roughness, and high mechanical strength, making it suitable for demanding cleanroom and precision engineering environments.

Material Properties

Key Features

• Low thermal expansion coefficient matched to silicon substrates
• High optical transmission from UV to near-infrared range
• Excellent chemical resistance to acids, alkalis, and solvents
• High thermal stability up to 450°C (long-term use)
• Short-term resistance up to 500°C
• Ultra-smooth surface quality (Ra < 1 nm, DSP available)
• High mechanical strength and excellent scratch resistance
• Low autofluorescence for biomedical applications
• Excellent flatness and low TTV for precision processes

Applications

Semiconductor and MEMS Applications

• MEMS sensors and microdevices
• Wafer-level packaging substrates
• Silicon anodic bonding processes
• Microfluidic chips and lab-on-chip systems
• Wafer carrier and thinning processes

Optical and Photonic Systems

• Laser windows and optical components
• Microscope slides and imaging systems
• Optical filters and precision substrates
• High-stability optical assemblies

Biomedical and Analytical Devices

• Biochips and diagnostic platforms
• PCR and lab-on-chip systems
• Low-autofluorescence detection systems
• Microfluidic analytical devices

Industrial and High-Temperature Applications

• Furnace observation windows
• Chemical reactor sight glasses
• Sensor protection windows
• Environmental monitoring systems

Available Specifications

Advantages

BF33 borosilicate glass wafer combines silicon-matched thermal expansion, excellent optical performance, high chemical durability, and MEMS-compatible surface quality.

It is widely used as a bridge material between semiconductor processing, optical engineering, and micro-scale device fabrication.

FAQ

What is BF33 borosilicate glass wafer?

BF33 is a high-purity borosilicate glass wafer produced by microfloat technology, featuring low thermal expansion, high optical clarity, and strong chemical resistance.

Why is BF33 used in MEMS applications?

Its thermal expansion closely matches silicon, reducing stress during bonding and improving stability in MEMS and wafer-level processes.

Can BF33 wafers be polished?

Yes, BF33 wafers are available in SSP and DSP forms. Double-side polished wafers can achieve surface roughness below 1 nm.

Is BF33 suitable for optical applications?

Yes, it provides high transmission from UV to near-infrared wavelengths, making it ideal for optical and photonic systems.

Related Products

JGS1 JGS2 Wafers Optical Grade Fused Quartz Wafers 2-12 inch​​